Revolutionizing High-Performance AI and Data Center Connectivity
At DesignCon 2025, TeraSignal, a trailblazer in intelligent interconnect technology, joined forces with Synopsys to reveal a successful interoperability demonstration of their cutting-edge solutions. The collaboration showcased TeraSignal’s TSLink intelligent chip-to-module (C2M) interconnect working seamlessly with Synopsys’ 112G Ethernet PHY IP. This marks a significant milestone in optimizing low-power, low-latency technologies for AI and data center infrastructure.
Simplifying Optical Module Deployment
By leveraging the advanced diagnostic and link training capabilities of TSLink in combination with Synopsys’ silicon-proven Ethernet PHY IP, the partnership simplifies the deployment of Linear Pluggable Optics (LPO), Near Package Optics (NPO), and Co-Packaged Optics (CPO). These innovations enable architects to connect ASICs with optical modules that ensure maximum signal integrity and performance.
Supporting both PCIe 64Gb/s and Ethernet 106Gb/s standards, TeraSignal’s protocol-agnostic TSLink offers broad applicability, reduced latency, and enhanced integration for high-speed data transmission in AI and high-performance computing environments. This groundbreaking approach eliminates the need for DSPs, cutting power consumption by 50%.
Meeting Evolving Data Center Needs
As hyperscale architectures evolve, the demand for optical interconnects with low power consumption and high bandwidth is growing rapidly. According to Neeraj Paliwal, senior vice president of IP product management at Synopsys, “With TeraSignal’s TSLink and our 112G Ethernet IP, designers can now access proven, interoperable technologies to enable high-performance connectivity for next-generation optical modules.”
Rajinder Cheema, Corporate Senior Vice President at Socionext Inc., emphasized the importance of TSLink in enabling application-specific solutions. “TeraSignal’s integration with Socionext’s custom SoCs empowers the development of optimized systems with reduced power consumption and superior link performance,” he noted. This is particularly valuable in applications like AI inference, machine learning, and data center switching.
A New Standard in Interconnect Technology
Dr. Armond Hairapetian, Founder and CEO of TeraSignal, hailed the interoperability as a game-changer. “This collaboration sets a new benchmark in intelligent interconnects, offering a protocol-agnostic, plug-and-play solution that minimizes design risks while advancing AI and data center infrastructure.”
Live Demonstration at DesignCon 2025
The TSLink solution and its interoperability with Synopsys’ Ethernet PHY IP were demonstrated live at DesignCon 2025, held from January 28-30 in Santa Clara, California. Broader TSLink reference designs, featuring TSLink firmware and the TS8401/02 Intelligent Re-Driver, are set to be released later this year.
Looking Ahead
This collaboration between TeraSignal and Synopsys highlights the importance of partnerships in the tech industry to stay ahead of evolving demands. As the AI and data center landscape continues to grow, innovations like these are critical for meeting the rising need for efficiency, reliability, and scalability in infrastructure.
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