DustPhotonics has introduced a new generation of Photonic Integrated Circuits (PICs) designed to power the next wave of AI and hyperscale data center infrastructure. The newly announced Tamar200 and Tamar chips are engineered for high-performance, high-density environments and will be showcased at the OFC Trade Show in San Francisco from April 1–3, 2025.
Industry-First 1.6T-2xFR4 PIC Redefines Performance Standards
The Tamar200 marks a significant milestone as the world’s first merchant 1.6T-2xFR4 photonic chip. It delivers two 800G-FR4 transmission channels, with each optical lane pushing data rates of 200Gb/s. The Tamar variant, on the other hand, supports two 400G-FR4 channels at 100Gb/s per lane, targeting next-gen 2xFR4 optical modules.
Enhanced Efficiency with Proprietary Optical Technology
Both chips are equipped with a low-loss athermal integrated optical multiplexer and DustPhotonics’ advanced Mach-Zehnder Modulator (MZM) technology. This innovation eliminates the need for Thermoelectric Coolers (TEC), resulting in significant power savings and improved thermal management. Designed for use with external lasers, these chips only require 40mW-class lasers per wavelength.
Compact Design for High-Density Modules
Engineered with a compact footprint, the PICs are ideal for OSFP and other high-density applications. They are versatile enough to support fully retimed DSP configurations, Linear Pluggable Optics (LPO), and Linear Receive Optics (LRO) across transmission distances of up to 2km.
Addressing Supply Chain Challenges in Silicon Photonics
“We are proud to deliver the first merchant-grade 2xFR4 silicon photonics solution,” said Yoel Chetrit, CTO of DustPhotonics. “These products are key to easing current EML (Electro-Absorption Modulated Laser) supply constraints facing the broader industry.”
Live Demonstration and Availability
The Tamar series will be available for sampling later this month. Attendees of the OFC Trade Show can visit Booth #5321 to see the technology in action.
As hyperscale operators and AI-driven enterprises continue to scale their infrastructure, innovations like DustPhotonics’ new PICs are critical to meeting escalating demands for bandwidth and energy efficiency. These advancements also align with broader industry efforts to simplify AI infrastructure and automation at scale.
