SK hynix is set to make waves at CES 2025, the world’s largest consumer electronics show, by unveiling its groundbreaking advancements in AI memory technology. The event, scheduled from January 7-10 in Las Vegas, will feature the company’s vision to position itself as a ‘Full Stack AI Memory Provider,’ offering an all-encompassing range of AI-related memory products.
The announcement comes with participation from top executives, including CEO Kwak No-jung and Chief Marketing Officer Justin Kim. Highlighting the company’s focus, Justin Kim noted, “We aim to redefine the future of AI infrastructure by introducing optimized solutions for on-device AI and next-generation memory technologies, including our hallmark AI memory products such as HBM and eSSD.”
Revolutionary Products on Display at CES
Among the lineup, SK hynix plans to showcase the HBM3E with an industry-leading 16-layer configuration. Developed using the advanced MR-MUF process, this product ensures maximum heat dissipation and minimizes chip warpage, setting a new benchmark in high-performing memory solutions. Additionally, the company will present its high-capacity enterprise SSD products, including the ‘D5-P5336’ 122TB model. This SSD, boasting the largest capacity to date, is specifically designed to meet the demands of AI data centers seeking high power and space efficiency.
Another standout product is the Low Power Compression Attached Memory Module 2 (LPCAMM2), which enhances power efficiency and performance while saving space. With its ability to replace two traditional DDR5 SODIMMs with just one LPCAMM2, it offers a transformative solution for edge devices like PCs and smartphones.
Innovative Technology for Next-Gen Data Centers
In a bid to lead the next wave of AI-driven innovation, SK hynix will debut modularized AI products such as the Accelerator-in-Memory-based AiMX and the CXL Memory Module-Ax (CMM-Ax). These products are expected to revolutionize next-generation data centers by improving performance and energy efficiency.
Additionally, the company will spotlight its advancements in Zoned Universal Flash Storage (ZUFS), which optimizes data management by grouping data with similar characteristics within the same flash memory zone. Such innovations highlight the company’s commitment to delivering solutions that enhance both efficiency and sustainability.
Collaborative Efforts with SK Group
SK hynix will host a joint booth under the theme “Innovative AI, Sustainable Tomorrow,” along with SK Telecom, SKC, and SK Enmove. The exhibition will showcase SK Group’s integrated AI infrastructure and services designed to transform industries globally. The dynamic display, represented through waves of light, promises to captivate attendees and emphasize the group’s technological prowess.
Future Plans for AI Memory Leadership
Looking ahead, SK hynix aims to launch its 6th generation HBM (HBM4) in the latter half of 2025, further solidifying its dominance in the AI memory market. CEO Kwak No-jung remarked, “The accelerating impact of AI demands continuous innovation. Our commitment is to provide our customers with unmatched value and redefine possibilities in the AI era.”
Related Insights
For a deeper understanding of how cutting-edge hardware is shaping the AI revolution, read about Exabits’ groundbreaking use of NVIDIA H200 GPUs, which complements the advancements being showcased by SK hynix at CES 2025.
